Beijing, August 13 (Xinhua) on August 12, Jilin Hua microelectronics held the Beijing media exchange meeting of “new infrastructure – new outlet for chip manufacturing”. In Beijing, more than 30 media reporters attended the meeting. The person in charge of jilinhua Microelectronics Co., Ltd. briefed reporters and guests on the latest breakthroughs made by China microelectronics in the field of semiconductor chips, and gave on-the-spot answers to the key issues concerned by media reporters. < p > < p > the person in charge of jilinhua microelectronics introduced to reporters and guests the latest breakthroughs made by huamicroelectronics in the field of semiconductor chips, and gave on-the-spot answers to the key questions concerned by media reporters. < / P > < p > the highlight of this Beijing media exchange conference is the core components of new energy vehicles – series of IGBT products introduced by huamicroelectronics to the media. The DSC double-sided module under development can greatly reduce the volume of motor controller and improve the driving range of new energy vehicles, which is also one of the pain points most concerned by consumers. IGBT module is the core component of new energy vehicle power system. The series of IGBT products developed by Hua microelectronics for new energy vehicles adopt the advanced trend + FS structure design and ultra-thin chip technology. At present, 650V and 1200V series IGBT modules have a maximum current of 800A. The company is developing a DSC double-sided heat dissipation module, which integrates temperature and current sensing It can further reduce the volume of new energy vehicle controller, reduce the vehicle loss, improve the efficiency of the whole machine, and improve the range of driving. In March 2020, “new infrastructure” has become a hot word in China’s economy. With the introduction of the national new infrastructure construction strategy, the central and local governments have issued relevant policies intensively for a time, guiding and escorting the “new infrastructure” one after another. Different from the construction of traditional infrastructure, the “new infrastructure” is more about the “Reconstruction” of production factors by using Internet and Internet of things technology. “New infrastructure” mainly involves “5g base station construction, UHV, intercity high-speed railway and urban rail transit, new energy vehicle charging pile, big data center, artificial intelligence and industrial Internet”. < p > < p > Hua microelectronics is a leading enterprise in China’s power semiconductor device industry. As a supporting supplier of Panasonic, Hitachi, Hisense, Skyworth, Midea, Changhong and other well-known enterprises at home and abroad, a person in charge of huamicroelectronics told reporters: “5g, new energy and other” new infrastructure “all involve power semiconductor chips and other basic components. Power semiconductor industry is closely related to the” new infrastructure “, which is the” heart “of” new infrastructure “. As the bottom support of the “new infrastructure” field and the structural opportunities of semiconductor industrialization, the demand for local power semiconductor chips will tend to be strong. ” At present, Hua microelectronics, Jilin Hua Microelectronics Co., Ltd., has a 4-inch wafer production line, a 5-inch production line, a 6-inch production line and an 8-inch production line for power semiconductor devices. In 2019, the company will produce 4 million power semiconductor wafers. With excellent production capacity, Hua microelectronics has become a leading enterprise in China’s power semiconductor device industry. China microelectronics products cover all branches of power semiconductors. The products developed and sold include IGBT, power MOS, fast recovery diode, thyristor, JFET transistor, power integrated circuit, etc., which are rare in China. Certified by the Ministry of science and technology, Chinese Academy of Sciences and other national institutions, huamicroelectronics is listed as a national post doctoral research workstation, a national innovative enterprise, a national enterprise technology center, and a CNAs laboratory. On March 16, 2001, the company was listed on the A-share main board of Shanghai Stock Exchange. China microelectronics products cover all branches of power semiconductors, making it the most complete manufacturer in China. At this Beijing media exchange meeting, huamicroelectronics mainly introduced various key applications of its products in the field of new infrastructure construction. < / P > < p > new energy vehicle charging pile, China’s new infrastructure will vigorously develop new energy vehicles, and the demand for supporting new energy vehicle charging piles is increasing. In the field of charging pile, Fred and superjunction MOSFET can be used in three-phase Vienna input rectifier, superjunction MOSFET can be used in LLC resonant circuit, and FRD and SiC SBD solutions can be provided in output rectifier part. < / P > < p > server power supply is an indispensable and important support in the construction of big data center in the new infrastructure construction. The power supply and output rectifier parts of the server in the data center need a large number of over junction MOS and low and medium MOS devices. Hua microelectronics’s 600 ~ 650V superjunction MOS on resistance can achieve 35 milliohm, and medium and low MOS resistance can achieve 2 milliohm, which can achieve high efficiency power conversion. The construction of data center provides strong support. According to the data of the Ministry of industry and information technology, the 5g network construction is based on the large-scale construction of 5g base stations. According to the data of the Ministry of industry and information technology, China has officially launched 5g commercial operation in 2019, with 126000 5g base stations opened nationwide. It is estimated that more than 600000-800000 5g base stations will be built in 2020, 5g communication voltage is indispensable in some power semiconductor devices such as PFC, DC / DC, synchronous rectification and battery protection. Huamicroelectronics can provide superjunction MOSFET, medium and low voltage MOSFET and SiC products. < p > < p > the industrial Internet, which connects people, data and machines, is the third wave of the industrial revolution. Hua microelectronics is committed to the manufacturing and R & D of power devices for industrial frequency conversion applications, providing a solid manufacturing foundation for the development of China’s industrial Internet. Can provide solutions including IGBT, IPM, PM module and MOSFET products. Hua microelectronics, located in Jilin City, Jilin Province, is a state-level high-tech enterprise focusing on the production and development of power semiconductor devices and power integrated circuits. < p > < p > although as early as the early 1960s, the state has set up more than ten semiconductor factories represented by Liaojing and Hajing in the three eastern provinces, but today, only Jilin Huawei has survived and gradually developed under the condition of no industrial environment and market advantage and no resource advantage. It is the only one in Northeast China that has survived and gradually developed Conductor enterprise. < p > < p > Hua microelectronics is the leading enterprise in China’s power semiconductor device industry. As the IDM enterprise with the most complete categories of power semiconductor devices in China, in the future, China microelectronics will not be absent in 5g, artificial intelligence, industrial Internet and other fields. < p > < p > just at the time when China is vigorously developing China’s internal recycling economy, the Beijing media exchange meeting of “new infrastructure – new outlet for chip manufacturing” of huamicroelectronics indicates that under the wind of national new infrastructure and under the strategy of internal circular economy, huamicroelectronics will usher in greater development opportunities, and continue to help China’s semiconductor industry develop and innovate. American companies begin to give up R & D: who should pay for corporate research?