Foresee 2020: panorama of China’s etching equipment industry in (attached with industrial policy, market scale, competition pattern, etc.)

Etching is the process of selectively removing unwanted materials from the surface of silicon wafer by chemical or physical methods. Its basic goal is to correctly copy mask patterns on the coated silicon. It is an important step in semiconductor manufacturing process, microelectronic IC manufacturing process and micro nano manufacturing process. The fabrication of etching equipment is also an important part of IC manufacturing. The etching equipment industry chain and the links of etching in the semiconductor industry chain are as follows: < / P > < p > from the perspective of policy environment, China attaches more importance to the etching equipment industry. It is mainly reflected in the preferential policies for the whole IC industry chain enterprises and the related planning and promotion for the semiconductor equipment industry. For example, it is clearly pointed out that the manufacturing of 14nm etching equipment and core parts should be conquered; the project has also introduced industrial investment and fostered the industry related to etching equipment. The wet etching is a pure chemical reaction process, which can use the chemical reaction between the solution and the pre etching material to remove the part not covered by the masking film material to achieve the purpose of etching, while the dry etching does not use the solution for etching. According to the etching methods, dry etching can be divided into physical etching, reactive ion etching and chemical etching; according to the type of material being etched, it can be divided into dielectric etching, metal etching and silicon etching. < / P > < p > the development of etching equipment is closely related to the development of etching technology. Different etching technologies need different etching equipment to achieve, but different etching equipment in general will still follow a unified specification in the manufacturing process. According to the content disclosed in the prospectus of the company, the general manufacturing process of etching equipment is as follows: < / P > < p > at present, the main enterprises in the global etching equipment industry are Fanlin semiconductor, Tokyo electronics and applied materials. From the sales situation of etching equipment, the total market share of the three enterprises accounts for more than 90% of the global etching equipment market. Among them, Fanlin semiconductor occupies 52% of the market share, Nikon and Canon occupy 20% and 19% respectively. < p > < p > from the perspective of market size, the market scale of etching equipment will continue to grow from 2013 to 2019. The average scale of equipment market in 2019-2013 is about RMB 2 billion, with an average growth rate of about 115%. It is expected that the growth rate of etching equipment market will gradually slow down in the future, and it will reach 15.5 billion US dollars by 2025. < p > < p > in recent years, with the progress of domestic wafer fabrication process, multiple exposure technology has been gradually applied, and the potential demand for etching equipment has increased, which has driven the development of China’s etching equipment industry. With the promotion of policy and the progress of research and development, a number of excellent leading enterprises have emerged in China’s etching equipment industry. < / P > < p > the above data are from prospective industry research institute, which provides industrial big data, industrial planning, industrial declaration, industrial park planning, industrial investment promotion and other solutions. Older posts →