Huawei’s Kirin 9000 flagship chipset will be released in September, and mate 40 has three models

Huawei announced that it would hold a press conference on September 3 in Berlin during IFA 2020. Although Huawei did not disclose the announcement, it seems that everyone knows what will happen. < / P > < p > a new report says the event will launch the latest Kirin 9000 flagship chipset along with Huawei’s flagship smartphone mate 40 series. < p > < p > the upcoming Hisilicon Kirin 9000 of Huawei Hisilicon is manufactured by TSMC using 5nm node technology. It may become the first 5nm chipset in the world, ahead of similar chipsets from Qualcomm and apple. It remains to be seen what the Kirin 9000 SOC can do and how it will perform in other flagship products. Recently, the United States has strengthened its restrictions on Huawei, including about 70 branches on the list of entities in the Ministry of Commerce, requiring them to obtain special permission from the government to carry out business. < / P > < p > the latest ban prevents TSMC, the contract chipset manufacturer of Huawei, from accepting new orders from Huawei. TSMC will completely stop producing Huawei’s Hisilicon chips from September 15. < p > < p > Huawei expects to get the last batch of chip orders from TSMC before September 14, 2020. Therefore, Huawei mate 40 series may be the last flagship product to use the company’s customized Hisilicon chip. < / P > < p > the upcoming Huawei mate 40 smartphone has different specifications. The snapshot shows that the device has an eight core Hisilicon Kirin 9000 SOC with 8 to 12 GB of ram and 128, 256, or 512 GB of storage memory. Removable battery, gravity sensor, proximity sensor, light sensor, acceleration sensor, electronic compass, fast charging bracket, gyroscope and fingerprint sensor are located under the screen surface. < / P > < p > smartphones should be equipped with flagship cameras. It’s at least as good as Huawei’s P40 camera, but it hasn’t reported its specifications. Huawei mate 40 will appear in September this year, which was personally confirmed by Yu Chengdong, CEO of Huawei’s consumer business group. < p > < p > Huawei has been looking for a viable alternative to TSMC. The reason for pursuing this goal is the cooperation with SMIC, which has brought Hisilicon’s Kirin 710A chip. Unfortunately, SMIC is still far away from manufacturing advanced 7Nm or 5nm chips. Even modern midrange mobile phones have been manufactured with 12 or 7 nanometers. < p > < p > according to the report, Huawei is now in its own hands and is expected to start its chip manufacturing process at least before the end of the year and compete with industry giants such as Samsung, TSMC and Intel. Since semiconductor manufacturing is a complex and expensive process, there are many questions about whether Huawei can be independent. In any case, we can only wait and see whether Huawei can achieve this goal successfully. Continue ReadingASMC, a lithography maker, was one of TSMC’s 14 top suppliers last year