Too much toothpaste? Intel announced 10 nm new technology, 11 generation core takes the lead

Intel is quite busy these days. Considering that the 11 generation core processor will be on the market next month, we are rushing to promote it here. On the one hand, it creates momentum for the upcoming tiger Lake processor, on the other hand, it also eliminates some negative effects of 7Nm process dystocia. Recently, Intel’s Architecture Day activities mainly introduced the architecture and performance of the new generation processor. One of the concerns is that the new generation core processor is likely to take the lead in using the new 10nm process technology. Of course, in addition to the new 10nm technology, processor architecture and Intel’s next-generation graphics core Xe are also the focus of attention. < / P > < p > in this architecture introduction meeting, Intel’s first big move was the new 10nm technology. Intel has been developing 10nm process for a long time. In terms of efficiency, Intel’s 10nm process can be compared with TSMC’s 7Nm process. It can be said that Intel’s 10nm process is currently the world’s most advanced. However, it is obvious that the development of 7Nm is not smooth, so it is urgent for Intel to continue to tap the potential of 10nm process. < / P > < p > the new 10nm technology introduced by Intel this time is called superfin, which is expected to be used in the 11th generation core and the 12th generation core processor. According to Intel, superfin improves the epitaxial growth of the source and drain structures, increasing stress and reducing resistance to allow more current to pass through the channel. < / P > < p > on the superfin technology, Intel has improved the gate process to drive higher channel mobility, which allows the charge to move faster and has additional gate spacing options. As a result, the chip can provide a higher drive current when it needs extreme performance. In short, processors produced with this technology can achieve higher frequencies and stay at higher frequencies for longer periods of time. < p > < p > superfin’s new thin barrier layer reduces the through-hole resistance by 30%, which can increase the interconnection efficiency. Compared with the 10nm process of other manufacturers, Intel’s super MIM capacitor provides a capacity value of 5 times in the same area, so that the voltage will not drop rapidly and the processor performance can be guaranteed. In short, this is a good solution to improve performance and reduce power consumption. < / P > < p > therefore, from this technology point of view, Intel has made the 10nm process to the extreme. We hope to see the 11th generation core have higher and more stable working frequency under the 10nm process. As for heating and power consumption, the answer may only be obtained when the finished laptop has been tested. But at least we have reasons to be more optimistic than the 10th generation core. < / P > < p > in addition, Intel will use new packaging on the next generation of processors. Intel said that the test chip with hybrid package was put into production in the second quarter of 2020. Hybrid packaging can replace most of the current packaging technologies. Compared with the current mainstream hot pressing packaging solutions, hybrid packaging can achieve a very advanced bump spacing of less than 10 μ m, which provides higher interconnection density, frequency bandwidth and lower power consumption. < / P > < p > in terms of processor architecture, the 12th core processor will adopt willow Cove CPU microarchitecture and use 10nm superfin technology. Intel officially claims that this architecture and process technology has a processor performance improvement of more than one era, which will greatly improve frequency performance and power efficiency. In addition, it will import a redesigned cache architecture and enhance security through Intel control flow enforcement technology. In other words, the performance of the 12th generation core processor is likely to exceed that of the 10th generation core processor by more than 100%, which is indeed worth looking forward to. < / P > < p > and the 10th generation of core tiger lake, which will be launched next month, is also said to provide intelligent effects and breakthrough progress in key operational performance. Intel said that tiger lake will also bring a huge improvement in AI and graphics performance through the optimization of CPU and AI accelerator, as well as the first single-chip architecture integrated with Xe LP graphics core. In particular, the new generation of core will be integrated into the latest thunderbolt 4 standard at the same time. Of course, whether you use it or not depends on the notebook manufacturer. < / P > < p > at present, tiger lake can carry up to 96eu Xe graphics core, improve power efficiency management, CPU integration of lightning 4 / USB4, support of PCIe Gen 4, can achieve low latency, high frequency bandwidth memory reading, etc. more detailed performance and features will be described in September. < / P > < p > in addition, it has been rumored that the 12th generation core alder lake will adopt a large and small core design, and Intel has confirmed this rumor. Among the 12 generations of core, the big core will use golden Cove architecture, and the minor core will use gracemont architecture. As for the working mechanism and performance performance, it is estimated that it will take some time before it is announced. After all, there is still a year to go before the 12th generation core. < / P > < p > and Intel has also made a relatively detailed description on the Xe graphics core that people are more concerned about this time. However, it is mainly aimed at the low-end low-power product Xe LP. It can be confirmed that in addition to the Xe LP built into tiger lake, Intel will also launch Xe LP for entry-level users. < / P > < p > from Intel’s introduction, Xe LP will be the most efficient graphics architecture for desktop and notebook computers, with up to 96 EU, and has a new architecture design, including asynchronous computing, view materialization, sampler feedback, updating AV1 encoded video, and a new graphics engine. In addition, Xe LP has new development in real-time game adjustment, video streaming and image sharpening. At the same time, Xe LP will improve the driver through new Dx11 and optimized compiler. The dxe-12 can only support one part of the features of the hardware. < / P > < p > in addition, Xe LP’s unique product has also been put into production, code named DG1, which is expected to be shipped in 2020. Depending on the situation, it is likely that the latter will be launched in the third and fourth quarters. At present, developers can obtain the development information of DG1 through Intel’s website, and DG1 will be the first unique product of Intel to develop Xe LP architecture for PC. < / P > < p > in addition, Intel will also use four DG1 cores to form a SG1 product for cloud games and video streaming. Currently, it is an Android cloud game and video service with low latency and high density, which will be shipped by the end of this year. With the software, this product can also achieve real-time game adjustment and sharpening functions. However, this has nothing to do with ordinary users. It is the vendors who are looking forward to implementing cloud services on Android, which should have some interest. < / P > < p > at the architecture meeting, Intel still had a lot of dry goods, which at least solved many people’s doubts. At the same time, many consumers are full of expectations for the 11th generation core processor. After all, after all, we are very concerned about whether the new generation of core can make a breakthrough in frequency after adopting the more advanced 10nm process. Of course, we have to wait until the product is on the market. However, Intel’s Xe LP graphics core seems to be lack of competitiveness. At least, in front of AMD and NVIDIA, we don’t see its advantages. Moreover, this generation of Intel’s graphics core does not seem to support hardware optical pursuit. Even if new products are launched for mainstream performance markets in the future, it will be difficult to shake the current unique market structure. < p > < p > however, Intel is seriously threatened by AMD in the x86 processor market. For Intel, if the 10th generation core processor can suppress the momentum of AMD ryzen 4000 series in the mobile notebook market, the task will be completed! Continue ReadingVideo Number assistant internal test online! Four functions let you send 1g video on the computer