On August 7, Yu Chengdong delivered a long speech at the 100 people’s Conference on China’s informatization. He talked about Huawei’s sanctions with the United States, Huawei’s ecology, Huawei’s semiconductor layout, and so on. He also described Huawei’s overall leadership from a serious backwardness more than a decade ago.
as for the OEM of Kirin chips, Yu Chengdong said that after September 15, Huawei could no longer cooperate with TSMC, and the Kirin chip on Huawei mate 40 series was officially identified as Kirin 9000, instead of Kirin 1020 and Qilin 1000 previously exposed!
Yu Chengdong said that “this year may be the last generation of Huawei Kirin high-end chips”. Because it may be the last generation, Huawei named it Kirin 9000 this time, but it lacks Qilin 1000, 2000 and 8000 in the middle.
in recent years, the continuous pressure and supply interruption suffered by domestic enterprises are largely due to the difficulties in chip technology. Although there are not a few Chinese chip R & D enterprises, few can really achieve large-scale commercial use, and the performance can meet the needs of high load scenarios.
compared with SMIC and TSMC, TSMC’s most advanced technology is 5nm, while SMIC can only mass produce 14nm at present. There is still a big gap between them. However, in the near future, China encourages chip manufacturing of 28nm and below, and will give relevant welfare benefits according to the relevant establishment time of semiconductor enterprises. This is also a good assist for the semiconductor industry as a whole.
from lithography machine to chip, China is constantly under the control of others in core technology. Only when we have a clear understanding of the facts and give up our illusions, can we not be controlled by others in the ever-changing international situation. Continue ReadingASMC, a lithography maker, was one of TSMC’s 14 top suppliers last year